GPD Feb Pocket 4 HX 370
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Key Specifications
Manufacturer: GPD
Processor: HX 370
Generation: Zen 5
Cores/Threads: 12/24
Integrated GPU: RDNA3.5 890M
Max RAM: 64GB
Release Date: January 2025
TDP: 28W
Processor & Graphics
CPU Details
Manufacturer: AMD
Generation: Zen 5
Tier: Ryzen 9
Model: HX 370
Cores: 12
Threads: 24
Graphics
Integrated GPU: Yes
iGPU Model: RDNA3.5 890M
Dedicated GPU: Not specified
Max Displays: 4
Memory & Storage
Memory (RAM)
RAM Options: 32GB • 64GB
Maximum RAM: 64GB
RAM Slots: 0
RAM Generation: LPDDR5X
RAM Type: Soldered
RAM Speed: 7500MHz
ECC Support: No
Storage
Drive Options: 1TB • 2TB
Max Drives: 0
NVMe Configuration: 1x Gen 4x4
NVMe Drives: 1
M.2 2242 Slots: 0
M.2 2280 Slots: 2
2.5" Drives: 0
3.5" Drives: 0
mSATA Slots: 0
mSATA2 Slots: 0
SD Card Slots: 1
Connectivity & Ports
USB Ports
USB-A 2.0: 1
USB-A 3.0: 2
USB-C 3.0: 0
USB-C 4.0: 1
USB-PD Ports: 1
USB-PD Wattage: 100W
USB-C Features: USB4 • 100W PD
Display & Network
HDMI Ports: 1
HDMI Configuration: HDMI 2.1
DisplayPort: 2
DP Configuration: DP 2.0
OCuLink: Not specified
Ethernet Ports: 1
Ethernet Configuration: 1x 2.5GbE
Ethernet Controller: Not specified
WiFi: WiFi 6E
WiFi Controller: AMD
Bluetooth: Bluetooth 5.3
3.5mm Ports: 1
PCIe Configuration: Gen 4
Card Ports: 1x microSD
Additional Ports & Expansion
Serial Port Configuration
| Type | RS232 |
| Count | 1 |
0
Power & Physical Specifications
Power
TDP: 28W
PSU Wattage: 100W
PSU Type: GaN
Power Connector: [object Object]
Battery: 44.8Wh
Physical
Dimensions (W×D×H): 207 × 145 × 22 mm
Volume: 0.66033L
Weight: 770g
Kensington Lock: No
Noise Level: 43dB
Cooling System
| Type | Active |
| Method | Air |
| Fan Count | 2 |
System & Software
System Information
Release Date: January 2025
Handheld: Yes
Built-in Screen: Yes
BIOS: UEFI
Warranty: 0 years
Operating System: Windows 11
Additional Information
Other Features
8.8-inch 2.5K 144Hz touchscreen with modular ports